Twin Power Design

GIGABYTE X570S Motherboards are equipped with best in class power solution to release the full potential of the latest AMD Ryzen™ 5000 Series CPUs. The VRM power design includes MOSFETs which Vcore and SOC accompanied by digital PWM, premium chokes and high quality capacitors to offer extraordinary stability and precision to the high performance CPU. In addition, Six-layered PCB and comprehensive thermal solution allows enthusiasts to enjoy the extreme overclocking performance without compromise. 

GIGABYTE Active OC Tuner

With GIGABYTE's exclusive Active OC Tuner BIOS function, CPU* can work with AMD P.B.O. for gaming and other light workload applications with the highest CPU boost clock, but when the applications require all CPU cores horsepower, it automatically switches to the Manual OC mode where it can utilize the high frequency for all the CPU cores.

ㆍActive OC Tuner switches profile based on user scenario automatically ㆍ5% performance increase

Memory Layout - Daisy Chain Design

With the optimized daisy-chain routing, GIGABYTE X570S motherboards provide a proven speed of up to DDR4-5400+ MHz with high density memory modules*. Optimized daisy-chained routing eliminates the stub effect, pushes the one DIMM per channel in dual channel interleaving mode to hit higher memory frequencies, and provides professional gamers a denser and faster system memory

ADVANCED THERMAL SOLUTION

X570S AORUS PRO AX uses an unprecedented and innovative thermal design to ensure the best CPU, Chipset, SSD stability and low temperatures under full loading application and gaming.

Fins-Array II

Fins-Array II uses brand new louvered stacked fins technology which is usually only used on industrial equipment that need compact heat exchangers. It has a special secondary fins structure that enhances heat transfer performance.

Circulation Zone

Because of pressure difference and flow separation, a circulation zone will be formed between louvered fins. This circulation will cause flow entrain and eject in the vortice form which improves thermal efficiency.

Direct-Touch Heatpipe II

With an extra large 8mm heatpipe and made by a new manufacturing process which has narrow down the gap between the heatpipe and heatsink. The new Direct-Touch Heatpipe II greatly helps to dissipate the heat on MOSFETs.

NEXT GENERATION CONNECTIVITY

A Flagship product needs to be future-proof so your system stays up-to-date with the latest technology. X570S AORUS PRO AX provides all next generation network, storage, and WIFI connectivity to keep you up to speed.

2X Faster than ever

Adoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least 2X faster transfer speeds compared to general 1GbE networking, perfectly designed for gamers with ultimate online gaming experience.

M.2 Thermal Guard III

Continuing the advantages of M.2 Thermal Guard II design which using the double-sided thermal pads to elevate the height of M.2 heatsink as increasing surface area to dissipate heats on M.2 SSDs. M.2 Thermal Guard III constructed with 2.6X optimized heat dissipation surface to prevent throttling and bottleneck that high-speed/ large capacity of PCIe 4.0 M.2 SSDs may cause, especially under heavy workload.

Intel® WiFi 6 802.11ax + BT 5 Module

Intel® Wireless solution supports 802.11ax, enables gigabit wireless performance, provides smooth video streaming, better gaming experience, few dropped connections and speeds up to 2.4Gbps*. Moreover, Bluetooth 5 provides 4X range over BT 4.2 and with faster transmission.

Connecting the Future - USB 3.2 Gen 2x2 Type-C®

Featuring the USB 3.2 Gen 2x2 design which is doubled the performance than previous generation of USB 3.2 Gen 2. It works up to 20Gbps ultra-fast data transfer while connecting to USB 3.2 compliant peripherals. Through the USB Type-C® connector, users can enjoy the flexibility of reversible connection to access and store massive amounts of data rapidly.

HDMI 2.1 for 4K / 60P / 21:9 / HDCP 2.3 Support

HDMI 2.1, which is backwards compatible with HDMI 2.0/ 1.4 and offering 48 Gb/s of bandwidth – twice times more than previous generation. This unlocks the potential for users to transfer multiple video streams, as well as a native cinematic 21:9 ratio (which most movies are shot in), Full HDR and HDCP 2.3 support, to offer the best visual experience for viewers.

Smart Fan 6

Smart Fan 6 contains several unique cooling features that ensure gaming PC maintain its performance while staying cool and quiet. Multiple fan headers can support PWM/DC fan and pump, and users can easily define each fan curve based on different temperature sensors across the board via intuitive user interface.

High Current Support

Each fan headers support PWM and DC fan and Water cooling Pump , and up to 24W (12V x 2A) with Over-Current Protection

Precision Control

7 temperature/fan speed control points for precise fan curve

Fan Stop

Fan can stop completely below users' specified temperature point